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LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

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LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

Brand Name : JIMA

Model Number : EDCULP

Certification : SGS, ISO,Reach, RoHS

Place of Origin : china

MOQ : 100kg

Price : usd 15-20 kg

Supply Ability : 1000 Ton per month

Delivery Time : 5-15 days

Packaging Details : wooden carton

Purity : 99.8%

pinholes : None

Anti oxidation : 200 degree 60 minutes, 180 days 23 degree

Thickness : 105um 8um 35um

Color : red or black

Elongation : ≥ 5%

tensile strength : ≥ 180 MPa

peel strength : ≥ 1 N/mm

foil profile : RA≤2.5μm,Rz≤4.0μm

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LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

Matte side treatment low profile foil in back/red.

Features:

1. the treated foil in gray or red

2. High profile with properties of LP-S-B/R suitable for FCCL

3. Grain structure of copper foil leads to high flexibility

4. Excellent etching performance

5. low profile enables to make fine circuit pattern

Application:

1. Casting and lamination type FCCL

2. Super fine pattern FPC

3. Chip on flex (COF) for LED

LP Low Profile ED Copper Foil 18um 35um For Mobile Phone

Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)

Classification

Unit Requirement Test Method
Foil Designation / 1 H M 1 IPC-4562A
Nominal thickness / 10um 12um 1/2 OZ(18um) 3/4 OZ(25um) 1 OZ(35um) IPC-4562A
Area Weight g/㎡ 98±4 107±4 153±5 228±8 285±10

IPC-TM-650

2.2.12.2

Purity ≥99.8

IPC-TM-650

2.3.15

Foil Profile Shiny side(Ra) սm ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5

IPC-TM-650

2.3.17

Matte side(Rz) um ≤4.0 ≤4.5 ≤5.5 ≤6.0 ≤8.0
Tensile Strength R.T.(23℃) Mpa ≥260 ≥260 ≥280 ≥280 ≥280

IPC-TM-650

2.3.18

H.T.(180℃) Mpa ≥180 ≥180 ≥180 ≥180 ≥180
Elongation R.T.(23℃) ≥5 ≥6 ≥8 ≥10 ≥12

IPC-TM-650

2.3.18

H.T.(180℃) ≥5 ≥6 ≥7 ≥8 ≥8
Peel Strength(FR-4) N/mm 0.7 0.8 1.0 1.1 1.2

IPC-TM-650

2.4.8

Ibs/in 4 4.6 5.7 6.3 6.9
Pinholes&porosity Number No

IPC-TM-650

2.1.2

Anti-oxidization R.T.(23℃) 180days /
H.T.(200℃) 60 Minutes /

1.Standard Width 520mm,max width 1295(±1)mm,May according to the customer request tailor.

We test the peel strength with PI ,please reconfirm with your pp.

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LP Low Profile ED Copper Foil 18um 35um For Mobile Phone


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